TSMC is accelerating the expansion of chip packaging capacity needed

TSMC is accelerating the expansion of chip packaging capacity needed to produce NVIDIA AI chips

Representatives of TSMC recently made it clear that in chip packaging services using the CoWoS method, the company is now able to satisfy customer needs by 80%, and against the background of rapidly growing demand, it will only be possible Deficiency to be eliminated by the end of next year. According to Taiwanese media, TSMC is now forced to expand its core capacities faster than originally planned.

    Image source: NVIDIA

Image source: NVIDIA

edition Taiwan Economic Daily explains that TSMC initially expected to increase the capacity of the profile lines from 12,000 silicon wafers per month to 15,000 or 20,000 wafers per month and to complete this expansion phase by the end of the first quarter of next year. Now there is a need to increase the productivity of chip packaging lines by about 30% to 25,000 or 30,000 wafers per month using the CoWoS method. At least by the end of the second quarter, TSMC expects to receive everything it needs from device manufacturers to achieve new volumes of monthly chip packaging in the second half of next year. In general, as already mentioned, TSMC is ready to double its core capacity by the end of next year compared to current levels.

As Taiwanese sources explain, NVIDIA now receives about 60% of the quota for this type of service, remaining TSMC’s largest customer. At the same time, demand for CoWoS packages is also growing from other developers, including AMD, Broadcom and Amazon, forcing TSMC to increase production capacity at more than just NVIDIA’s whim. Suppliers of specialized chip packaging equipment are excited about the prospects for their sales growth through the middle of next year, as they will receive orders from TSMC by then.

Now, it is TSMC’s ability to package the A100 and H100 computing accelerators that is to some extent limiting NVIDIA’s ability to increase its shipment volumes amid the boom in artificial intelligence systems. NVIDIA management is ready to attract new partners to solve this problem, but still will not be able to “jump” TSMC, since the production technology of these NVIDIA chips only requires the use of CoWoS packaging from a specific Taiwanese contractor.

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Dylan Harris

Dylan Harris is fascinated by tests and reviews of computer hardware.

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