Thermaltake brought an interesting novelty to CES 2023 – the CTE C750 Air computer case, which uses the new form factor CTE (Centralized Thermal Efficiency). Its peculiarity lies in the fact that the motherboard is located at an angle of 90 degrees, and the motherboard tray itself is shifted to the center of the case, which expands the possibilities of ensuring efficient cooling of components.
The company notes that there is no need to create a new motherboard standard for the CTE form factor. Models of cases with horizontal installation of motherboards, that is, when the external connectors of the board are facing up, have been on the market for a long time. The position of the motherboard in the middle of the case, in turn, allows you to install additional fans in front, under and on the back of the case, creating positive air pressure inside.
The CTE C750 Air model is an example of a large and spacious case, where the motherboard tray located in the middle also offers the possibility of installing up to four 360 and even 420 mm liquid system radiators. The special case model has two additional 120mm slots on the top. The novelty supports the installation of 14 fans.
The CTE C700 Air Case model has a shallower depth, which is why it dispenses with a side row of fan seats and instead offers the installation of 120mm “turntables” front and rear. In addition, two 120mm fans can be mounted on the bottom and one more on the top.
The most compact models of Thermaltake cases of the new form factor are CTE C700 TG and CTE C500 TG. However, they also offer front and rear fan mounting.