The Taiwanese company Thermalright presented Heilos thermal pads, which should be used as an alternative to the usual thermal paste for central processors. The manufacturer has released versions of thermal pads for desktop platforms intelso and AMD.
Thermalright Heilos thermal pads are 0.2mm thick. The dimensions for the AMD socket AM4 and AM5 platforms are 40×40 mm. For Intel LGA 115x, LGA 1200 and LGA 1700 platforms, the thermal pads are smaller – 40 × 30 mm. The manufacturer specifies a thermal conductivity of 8.5 W/mK and a thermal resistance of 0.04 degrees cm²/W for the new product, which is comparable to the properties of thermal paste such as Arctic MX-4 and MX-5. The novelty does not conduct high electrical resistance and does not conduct electricity.
The advantage of thermal pads over thermal grease is that they are easier to apply. However, CPU thermal pads from other vendors have been criticized in the past for their inferior performance compared to leading thermal compounds. Independent tests will show how the Thermalright novelties presented will perform.
The manufacturer did not provide any information on the costs of the solutions presented.