The package of the Core i9 13900K appeared in the photo
Hardware

The package of the Core i9-13900K appeared in the photo – the kit will again contain a fake silicon wafer

Intel will use new packaging for the flagship Core i9-13900K processors – a Japanese source published their photo. Intel wants to officially present chips of the new generation next week.

    Image source: VideoCardz

Image source: VideoCardz

The flagship processors Raptor Lake-S come in compact boxes with a characteristic blue color and a minimalist design. The boxed version of the Core i9-13900K will still feature a fake silicon wafer used as a reflective element. It shipped with Alder Lake-S processors. On new processors, the color of the plate has changed from gold to silver.

In previous generations of Intel Core processors, boxed versions of flagship K-series models had a different packaging design than other processor boxes. The latter are usually content with simple boxes without any design frills.

    Boxed version of the flagship 9th Gen Intel Core.  Image source: Intel

Boxed version of the 9th Gen Intel Core flagship

    Boxed version of the 11th Gen Intel Core flagship.  Image source: Intel

Boxed version of the 11th Gen Intel Core flagship

The unusual-looking package (pictured below) of the third iteration for the flagship Core i9-12900K chip was replaced by the company with a regular, no-frills one just recently, in August.

    Boxed version of the 12th Gen Intel Core flagship

Boxed version of the 12th Gen Intel Core flagship

The use of more compact packaging of new Intel processors is not only aesthetic, but also practical. Thus, the manufacturer will be able to ship processors in larger volume as part of a batch. The same AMD might have problems with this, having decided to use very large boxes for older models of Ryzen 9 7000 processors.

    Image source: AMD

Image source: AMD

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Dylan Harris

Dylan Harris is fascinated by tests and reviews of computer hardware.

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