At the disposal of the portal VideoCardz turned out to be images of packages of future Intel Alder Lake-S desktop processors. It seems that in the new series of chips, the manufacturer decided to return to the practice of using two box designs – classic and unique.
Classic packaging (image below) does not differ from those used to supply boxed versions of the current generation of Intel Rocket Lake-S processors. These are compact boxes in branded colors and minimalist design. Alder Lake-S generation Core i5, Core i7 and Core i9 processors with unlocked multipliers will ship in the same form.
At the same time, the packaging of the flagship model Core i9-12900K will also receive an alternative design (image below). It can be seen that a fake silicon wafer is installed on the enlarged box, which is used as a reflective element.
The source notes that the packaging design for the Alder Lake-S generation Core i3 processors has not yet been disclosed. Most likely, this may indicate that Intel is not going to release chips of this level yet and will announce them already next year.
Intel will unveil the new Alder Lake series processors at its InnovatiON event from October 27-28. According to the latest data, the start of sales of the new series of processors is scheduled for November 4.