Many people are familiar with the problem of cooling processors and other chips. When the technological norms of production decrease, the severity of the problem increases, since the energy density increases significantly. how found out According to scientists, silicon can only improve the efficiency of heat removal by increasing its isotopic purity. Experiments have shown that the “natural” heat sink of the chips can be increased up to 2.5 times.
how famousAll silicon in our nature is made up of three stable isotopic forms: About 92% is silicon-28 (28Si), 5% – silicon-29 (29Si) and 3% silicon-30 (thirtySi). No one purifies silicon to make chips, although early studies have shown that the silicon-28 isotope has the best thermal conductivity and impurity inclusions of any silicon isotope 29Si and thirtySi are interrupted by heat flows. It was assumed that the gain was little more than 10% with significantly increasing cleaning costs.
National Laboratory scientists. Lawrence at Berkeley set up an experiment, in which they tried to estimate the degree of influence of silicon cleaning on the heat sink. They connected two thermocouples with 90 nm wide nanowires and measured the heat transfer. Pure silicon-28 was found to improve heat transfer from one heating element to another by 150%, rather than the 10% previously thought. Upon closer inspection, it turned out that the surface of the nanowire was covered with silicon dioxide, which prevented parasitic heat dissipation over the entire surface of the wire and concentrated the heat flow in its center.
Scientists do not give recipes for organizing heat dissipation from chips in new ways. However, they showed the possibility of several times increasing the efficiency of heat removal from crystals, which will cost candles – the cost of producing isotopically pure silicon for future chips.