Samsung announced the development of a series of LPCAMM (Low Power Compression Attached Memory Module) modules based on LPDDR5X RAM. LPDDR5X-6400 modules provide up to 7.5 Gbps throughput, occupy 60% less space, and deliver 50% more performance than standard SO-DIMM modules.
The new dual-channel modules are available in capacities of 32, 64 and 128 GB and will come onto the market in 2024. The CAMM memory specification was developed by Dell, which sent it to the JEDEC standards committee earlier this year – previously its modules were presented at Computex 2023 ADATAnow Samsung has prepared its own line.
Samsung has announced that LPCAMM will be supported in the Intel ecosystem, but there is no information yet about collaborations with other industry players such as AMD, Qualcomm and Apple. The Korean manufacturer said the new storage format would be tested by some major customers this year, adding that it could also be used in data centers. The main benefits of LPCAMM are a 60 percent reduction in board area compared to DIMMs, a 50 percent increase in performance, and a 70 percent increase in power efficiency. With its compact dimensions, the module includes SPD and PMIC chips. The new format will only be used with DDR5 chips and later standards, if of course it becomes widespread.
Samsung LPCAMM modules are removable, but there is also an option that is soldered to the motherboard. The CAMM specification allows for both single-channel and dual-channel memory modules – the latter offering twice the bandwidth of DIMMs – and Samsung has chosen the latter option for its own LPCAMM implementation. The Korean manufacturer is currently testing compatibility with a number of suppliers and is preparing to begin deliveries in 2024.