Samsung electronics introduced The industry’s largest 12nm 32Gb DDR5 DRAM chips, which they believe are perfect for the AI age. Previously, the company could only produce 32Gb chips using TSV-mounted 16Gb chips. The release of “solid” 32GB DDR5 chips in the same package with 16GB chips will reduce consumption and pave the way for promising 1TB memory modules.
Samsung estimates that doubling the capacity of DDR5 chips will result in 10% lower consumption of 128GB DDR5 modules. Interestingly, only recently – in May of this year – the company announced the start of production of 12nm 16Gb DDR5 DRAM. The current announcement does not mean that mass production of 32 GB chips will start immediately. The company promises to start production later this year. By increasing the capacity of commercially available chips to 32GB, memory manufacturers can move to mass production of 64GB DDR5 modules and server models up to 1TB.
“By building 12nm DRAM of the 32Gb class, we have provided a solution that enables DRAM modules up to 1TB in size. This makes us ideally positioned to meet the growing demand for high capacity DRAM in the age of AI and big data. said Sang Joon-hwang, executive vice president of DRAM Product & Technology at Samsung Electronics. “We will continue to develop DRAM solutions based on differentiated workflows and design technologies to push the boundaries of memory technology.”
Currently, memory manufacturers like SK hynix and Micron only offer 24GB DDR5 chips, allowing for mainstream modules up to 96GB, but Samsung is upping the capacity with a one-third higher density solution. However, Micron has also confirmed work on 32GB DDR5 chips in its roadmap, although these have not yet been officially announced.
In its history, Samsung has pushed the limits of memory by 500,000 times. The company introduced its first memory (64 KB) in 1983. Over the past 40 years, it has increased the capacity of microcircuits by incredible times, something few people could even think of at the time.