Samsung expands chip contract manufacturing with sophisticated lithography
Hardware

Samsung expands chip contract manufacturing with sophisticated lithography

It is widely believed that the competition between TSMC and Samsung Electronics in the semiconductor contract manufacturing market was a race in advanced technical processes, but the pandemic has thrown market participants into new conditions. The Korean giant now has no objection to expanding its facilities with sophisticated lithography.

Image source: Samsung Electronics

Image source: Samsung Electronics

The publication reports on the course change of Samsung Electronics Business Korea referring to the report of the company representatives on the summary of the results of the year 2021. The document states that in the medium to long term the company intends to expand its custom manufacturing capacity with mature lithography. Additional funding for these needs will be made available this year. Last year, Samsung spent a record $39 billion on building and modernizing businesses, a quarter of its core spend compared to 2020.

Samsung will also offer new transition stages of mature processes that will attract customers with their optimizations. For example, last October the company introduced a 17nm FinFET transistor manufacturing process that could be used to make image sensors and display drivers. At TSMC, technical processes from 16 nm and “thicker” accounted for half of the company’s sales at the end of 2021, at Samsung Electronics there was a trend towards advanced lithography. With that, the Korean giant controlled 40% of the market for chip manufacturing services with 10nm and above “thin” technical processes, but was clearly inferior to competitors in the area of ​​mature lithography.

Samsung Electronics is not losing hope of attracting up to 300 customers for its services by 2026 and tripling the volume of custom chip manufacturing compared to 2017. The company is also trying to keep up with TSMC and Intel in the field of advanced lithography, it will start mass production of 3 nm products with GAA transistor structure in the current half year and will master this by 2025 mass production of chips in 2 nm technology with a Third generation Surrounding Shutter (GAA) transistor structure.

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Dylan Harris

Dylan Harris is fascinated by tests and reviews of computer hardware.

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