MediaTek introduced the sub flagship Dimensity 8300 mobile processor with a
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MediaTek introduced the sub-flagship Dimensity 8300 mobile processor with a powerful AI engine

MediaTek announced a single-chip platform Dimension 8300, designed for lower flagship class smartphones. It offers a powerful central and powerful graphics processor, an accelerator for artificial intelligence algorithms, as well as support for modern high-speed storage and the latest wireless protocols. At the same time, the new product is characterized by increased energy efficiency.

    Image source: mediatek.com

Image source: mediatek.com

MediaTek Dimensity 8300 is equipped with an 8-core processor with four Arm Cortex-A715 and four Cortex-A510 cores on the latest Arm v9 architecture – compared to the previous generation chip, this enables a 20% increase in performance and a Energy increase of 30% efficiency. The updated Mali-G615 MC6 GPU promises a 60% increase in performance and a 55% increase in power efficiency compared to its predecessor. LPDDR5x RAM with up to 8533 Mbit/s and UFS4.0 MCQ are supported – they are 33% and 100% faster, respectively, than the solutions supported by previous generation mobile processors, assures MediaTek.

The most important innovation of the Dimensity 8300 is the integrated AI accelerator APU 780 with support for stable diffusion class models and large language models with up to 10 billion parameters. The accelerator performance is 3.3 times higher than that of the Dimensity 8200 chip. There is a 14-bit processing processor Images MediaTek HDR-ISP Imagiq 980, which allows you to record 4K videos at 60 frames per second and supports HDR.

High performance in games does not mean that the battery will drain faster: MediaTek HyperEngine technology optimizes the use of platform computing resources while controlling energy consumption. This means that the smartphone does not overheat, performance remains high, the battery has a long battery life and the user enjoys high frame rates, low latency and smooth movements on the screen.

The integrated 5G modem meets the requirements of the 3GPP Release 16 standard, which aims at stable network operation in weak signal conditions – resource optimization helps to increase connection speed and range for the sub-6 GHz range; the maximum speed on the incoming channel reaches 5.17 Gbit/s. MediaTek 5G UltraSave 3.0+ technology helps reduce power consumption by 20% compared to the previous generation chip. Supports the Wi-Fi 6E standard with 160MHz band and the hybrid parallel Wi-Fi and Bluetooth connection format, ensuring seamless collaboration between headphones, wireless gamepads and other peripherals.

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