During the Digital Expo 2.0 2022 event, Lian Li Industrial lifted the veil of secrecy on three new computer cases at once: these are the Lancool 216, DAN Cases A3 m-ATX and O11D Evo XL models, designed to cover gaming systems at different levels create .
The Lancool 216 mid-tower solution is designed for efficient cooling. The use of a liquid circuit with radiators up to 360 mm is permitted. An additional bracket for an external fan with a diameter of 120 mm can be attached in the rear part. If necessary, you can use a special bezel to close the holes in the plugs of expansion slots to prevent airflow pressure loss.
The DAN Cases A3 m-ATX is still in prototype form. Micro-ATX mainboards are supported, which can be mounted on the left or right due to the special design. There are four expansion slots and two slots for 2.5-inch drives. Depending on the configuration, an SFX or ATX power supply, a graphics card up to 380 mm long (horizontal or vertical installation), a radiator up to 360 format and a CPU cooler up to 158 mm high can be used. The sidewall can be mesh or glass.
The O11D Evo XL case is designed for E-ATX boards. Efficient liquid cooling with three standard radiators up to 420 mm can be used. The solution is modular, allowing the motherboard tray to take one of three positions.