Kioxia has announced a new generation of UFS 4.0 flash memory chips. Chips are produced in quantities of 256 and 512 GB and 1 TB. The company began shipping 256GB and 512GB chip samples this month. 1TB chip samples are scheduled to ship in October.
The company notes that the next-generation UFS 4.0 storage uses a compact chassis form factor and is designed for use in a variety of mobile devices, including flagship smartphones. New flash memory chips are expected to improve the efficiency of 5G technologies, increasing download speeds and reducing data transfer latency.
Kioxia has combined innovative BiCS FLASH 3D memory chips and a controller in a UFS 4.0 chip package designed according to JEDEC standards. The new flash memory chips support MIPI M-PHY 5.0 and UniPro 2.0 interfaces and offer a theoretical throughput of up to 23.2 Gbps per lane or up to 46.4 Gbps per chip. The company also notes that UFS 4.0 storage is backward compatible with UFS 3.1.
The key features of Kioxia’s next-generation UFS 4.0 flash chips are 18% faster sequential writes, up to 30% faster random writes, and up to 13% faster reads than previous-generation UFS flash chips. They support the new Supports High Speed Link Startup Sequence feature, which increases the connection speed between the flash memory chip and the device in which it is installed up to 1248 Mbit/s. Kioxia’s UFS 4.0 chips also offer Multi-Circular Queue support and an enhanced RMPB interface for improved throughput and data protection.