Intel Meteor Lake processors will be assembled from three crystals, two of them will be made by TSMC

In future processors of the Meteor Lake series, Intel will use crystals produced by three different technical processes at once, writes Taiwanese edition of the Commercial Times, citing its industry sources. Recall that this series of chips will come to the attention of the 13th generation of Core processors codenamed Raptor Lake, which, in turn, will be presented next year.

Image source: Intel

Image source: Intel

In the upcoming Meteor Lake processors, Intel will move away from the traditional single-chip structure of chips and will use several crystals or tiles (chiplets) at once, combined on a single substrate using the second generation of Foveros packaging technology. The technology was first used in last year’s energy-efficient Lakefield mobile processors, and will also be used in Sapphire Rapids server processors and Ponte Vecchio series GPUs due next year.

Thanks to reporters from CNET, we were able to see what Meteor Lake-M consumer mobile processors will look like. Earlier, Intel confirmed that the 14th generation of Core processors will be equipped with three chiplets: a compute with processor cores, a crystal with interfaces, and a graphics core. At the same time, it was suggested that the largest chiplet in a processor is a computing unit with cores. However, according to new information, it may be a new generation embedded GPU.

Image source: CNET

Image source: CNET

The Meteor Lake processors will feature Xe-LP Gen12.7 integrated graphics. Intel has already confirmed that up to 192 execution units will be included in the 14th Gen Core processor stack, which is twice as many as the integrated graphics core of current Alder Lake and future Raptor Lake processors. As the Commercial Times points out, the difference between the current generation of integrated graphics Gen12.2 and the future Gen12.7 will consist not only in different operating frequencies and the number of computing units, but also in a more perfect technological process for the production of new iGPUs.

Image source: Ctee

Image source: Ctee

In particular, the source says that TSMC’s 3nm process technology (N3) will be used for the integrated GPU of the Meteor Lake processors. The computing unit of the processor with cores, in turn, will be based on Intel’s own 4 (7 nm) process technology, and the crystal with interfaces (SoC-LP) will be manufactured using TSMC N4 or N5 process technology (different versions of 5-nm technology).

Intel has already announced that the graphics chips for discrete Arc Alchemist graphics cards based on the Xe-HPG architecture will be manufactured at TSMC’s facilities using its 6nm N6 process technology. The two companies will also collaborate on the production of Ponte Vecchio GPUs for data centers. The computing unit of these GPUs will use the TSMC N5 technical process, and the bus Xe-Link will be based on the process technology TSMC N7.

According to the latest rumors, Meteor Lake processors will be unveiled in the second half of 2023. They will be based on the second generation of hybrid architecture, which will include Redwood Cove large high-performance P-cores and Crestmont small energy-efficient E-cores.

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Dylan Harris

Dylan Harris is fascinated by tests and reviews of computer hardware.

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