Infinix introduces advanced 3D VCC liquid cooling technology for smartphones

Infinix introduces advanced 3D VCC liquid cooling technology for smartphones

Infinix company announced the development of an innovative liquid cooling technology for high-performance smartphones: The solution is called 3D Vapor Cloud Chamber (3D VCC) and is based on a redesigned vapor chamber.

    Image source: Infinix

Image source: Infinix

Compared to traditional products, the system is said to improve heat dissipation efficiency by 12.5% ​​and lower the temperature by about 3 degrees, which has a positive effect on device performance. This solution reduces throttling and prevents frame drops and screen freezes when working with heavy applications.

Thanks to the special shape of the cooling chamber, Infinix engineers were able to achieve a 20 percent increase in liquid volume and internal space compared to standard systems. At the same time, the advance in camera design allows for almost direct contact with the smartphone processor, which increases the coefficient of thermal conductivity and the degree of heat dissipation.

As the temperature in the refrigerated chamber rises, the liquid it contains evaporates, removing excess heat. Then the hot vapor enters the condenser, turns back into a liquid and, thanks to its special structure, returns to the cooling chamber through the hot and cold air circulation system.

When developing the system, Infinix specialists had to solve a number of difficulties. One of them is the need to ensure structural strength. The company’s engineers designed the internal three-dimensional structure in the form of a matrix support column, which compensates for the flatness and volume of the inner chamber.

The second major challenge was maintaining the integrity of the wick structure in the 3D chamber, as the unusual shape could lead to wrinkling that could potentially clog the entire cooling system. The solution was found thanks to a thorough analysis of the density of the capillary structure and advanced welding processes.

Specialists paid special attention to the location of the hole on the front of the case and the strength of its alloy, which made it possible to reduce the thermal resistance of the conductive medium. The team performed a significant amount of testing and testing before they were able to find the perfect position.

As a result of intensive work on the three main features of the new technology described above, Infinix was able to create a unique solution for liquid cooling of smartphones – the 3D vapor cloud chamber. The company plans to create thinner cooling chambers with more protrusions, use new materials, as well as integrate 3D VCC into the central frame of the smartphone.

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Johnson Smith

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