The largest supplier of HBM memory remains the South Korean SK hynix, but rival Samsung Electronics is planning to double its output of similar products this year. Japanese company Towa notes that orders for the supply of specialized equipment for memory packaging have increased by an order of magnitude this year, citing increased demand from South Korean customers.
The Japanese company Towa is the largest supplier of chip packaging equipment used in the production of HBM memory chips; it controls approximately 60% of the global market. Until now, it has been content with delivering one or two specialized machines per year, since HBM’s own production volumes have been limited. This year, as noted Nikkei Asian Review with reference to Towa management, an order has been formed for the supply of more than 20 units of specialized equipment, and it comes from large Korean customers. However, as can be judged by the activity of the Chinese CXMT, other clients are also not wasting time.
Towa technologies make it possible to fill the gaps between memory crystals and the substrate with a special composition, eliminating the access of air and moisture during operation. The company has achieved precision that allows it to work with gaps of 5 microns, which most competitors’ equipment is not always capable of. This is the reason for the increased demand for Towa equipment from Korean HBM manufacturers, as the source explains. Stock investors are also showing interest in the company – the Towa share price has increased by 359% since January last year.