Lithographic machines that combine operation with ultra-hard ultraviolet (EUV) radiation and high numerical aperture (high NA) are a necessary tool for mastering the so-called “Angstrom” engineering processes with standards below 2 nm, i.e. the ability of ASML to use them to arrange delivery of such systems before the end of this year is crucial for customers.
Recall that Intel once announced its intention to receive one of the first systems of this type (TWINSCAN EXE: 5200) and have it installed in a company under construction in Ohio by the end of 2024 to start production of components with Intel 18A to launch technology by 2025. The cost of a new generation scanner is $340 million compared to $150 million typical for current generation systems.
As mentioned ReutersPeter Wennink, CEO of ASML, admitted that even the resulting delays will not prevent the company from shipping the first high numerical aperture pilot systems to customers later this year. He said some of the suppliers were having problems ramping up production of the required components and product quality, which caused slight delays. But even under such conditions, the first example of the new lithography system will be delivered this year, as the ASML boss assured.
Separately, he pointed out that the company’s 30 percent revenue growth this year was due to increased sales of deep ultraviolet (DUV) lithography equipment, which is in demand from Chinese customers, among others. Such devices will outnumber even the more advanced devices for working with EUV lithography in the ASML sales structure. According to Wennink, however, the disparity will begin to narrow over the next year as new companies in Taiwan and the US need more advanced equipment.