AMD CEO Discusses 2nm 3nm Chip Manufacturing With TSMC

AMD CEO Discusses 2nm, 3nm Chip Manufacturing With TSMC

AMD CEO Lisa Su will visit Taiwan along with a number of other company executives between late September and early November to discuss working with local partners. The AMD management will negotiate with TSMC as well as chip packers and large PC manufacturers.

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During the visit, Ms. Su will meet with CC Wei, CEO of TSMC, to discuss the operation of the N3P (3nm process) and N2 (2nm process) production lines, reports DigiTimes citing their own sources. Company executives will discuss upcoming engagements using existing or future technologies.

AMD’s success in the processor market in recent years is partly due to TSMC’s ability to mass-produce state-of-the-art products. AMD needs timely access to processor design kits (PDKs) to build on its success. TSMC will start mass production on N2 nodes in the second half of 2025, so AMD needs to negotiate now to bring the technology into products in 2026.

In addition to advanced semiconductor manufacturing technologies, AMD’s success will also depend on packaging solutions – the company will continue to develop CPUs and GPUs from multiple crystals (chiplets). AMD already uses several innovative solutions today, but in the future the need for various packaging technologies will only increase, and it is necessary to negotiate production capacities and prices in advance. PCBs and substrates will be discussed with Unimicron Technology, Nan Ya PCB and Kinsus Interconnect Technology. Finally, AMD executives will meet with ASUS and Acer, Taiwan’s largest PC makers and long-time partners, as well as chipset developer ASMedia.


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Dylan Harris

Dylan Harris is fascinated by tests and reviews of computer hardware.

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